View all services of this unit Mechanical crystal and wafer processing
Basic Information
| Name: | Mechanical crystal and wafer processing | |
| Facility: | Chair of Coating Technologies in Electronics | |
| Partner: | Technische Universität Dresden (TUD) |
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Short Description
wafer processing
Description
Processing wafers, sapphire, and other materials by sawing, grinding, lapping, and polishing
Link to Further Details
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Access Requirements
A preliminary consultation is required; self-service is not permitted
Last Update
Last updated at: 20 March 2026 at 13:47:34