Reactive multitarget magnetron sputter technology and magnetron sputter
epitaxy (MSE) are used for the fabrication of high quality thin films of various
materials. The sputtering tool LS730s (von Ardenne GmbH) allows us to deposit thin films on up to four 150 mm diameter substrates at a time in RF, DC, and pulsed DC sputtering modes using heater temperatures of 650 °C. Argon oxygen and nitrogen are used as process gasses. The multitarget configuration offers several advantages, including the ability to deposit mixed and stacked films of various metals and oxides in a single deposition run, improving process efficiency and repeatability.
In addition, the tool is equipped with plasma emission monitoring (PEM) to support the stability of reactive sputter mode. By using this technique, reactive gas flow into the system is continuously adjusted based on the measured intensity of a specific emission line of one of the sputtered species. PEM technology allows coating uniformity and stability with time.

Preliminary consultation required, no independent use