X-Ray Powder Diffraction (XRPD)

Facility: Materials Center

You need a fast and reliable phase analysis and do not have the opportunity to measure it by yourself? We will provide you with XRPD measurements based on only 15 mg of material.

Studies on work and process design

Facility: CIMTT Centre for Production Engineering and Organisation

Support of small companies in certification according to DIN ISO 9001

Facility: CIMTT Centre for Production Engineering and Organisation

Supporting small companies in the introduction of knowledge management

Facility: CIMTT Centre for Production Engineering and Organisation

Soil classification in accordance with DIN 18196

Facility: Laboratorium für Bodenmechanik

Identification and classification of soil in accordance with DIN EN ISO 14688

Facility: Laboratorium für Bodenmechanik

Wafer Coating

Facility: Chair for Semiconductor Technology

Waferbeschichtung - Oxidation, PECVD-, ALD- und PVD-Prozesse für Herstellung funktionaler Schichten und Schichtsysteme, Diffusionsbarrieren, Metallisierungen verschiedener Einsatzbereiche.

Si-deep etching for MEMS, MOEMS and microfluidic

Facility: Chair for Semiconductor Technology

Si-deep etching for MEMS, MOEMS and microfluidic.

Additive and subtractive wiring technology

Facility: Chair for Semiconductor Technology

Additive and subtractive wiring technology - e.g. Damascene structuring.

Chemical layer structuring

Facility: Chair for Semiconductor Technology