We offere different Lithography services like exposure, coating, contacting and preparation. 

The coating of wafers involves applying a uniform layer of material onto the wafer's surface to enhance its properties and functionality. This process requires precision to ensure the coating is even and free of defects, as variations can lead to performance issues in the final semiconductor devices. We offer spin coating, development and spray Coating with different instruments. 

As a next step we offer Deep Ultraviolet (DUV) lithography to transfer circuit patterns onto wafers with high precision.